





| 制造工艺 | 模具成型,机械加工。 材料:不锈钢, 铝合金及工程塑料 |
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| 应用领域 | 订购指南 | ||
| 需要提供的信息 | 表面处理 | 可选项 | |
| 产线周转晶圆,适用以下工序: 背面减薄 晶圆切割 装片 晶圆运输 |
设备型号及生产厂家 晶圆尺寸及封装形式。 |
电抛光 镜面抛光 电镀 |
激光刻字。 接受定制。 |
| Manufacturing process | Molding and Machining Material : Stainless Steel , Aluminum & Plastic |
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| Application | How to order | ||
| Data input | Surface treatment | Option | |
| Use for handling wafer in the process of Back grinding Wafer sawing Die attach Inline process handling Shipping |
The machine maker and machine model; Package description; Wafer size. |
Fine polishing Electric polishing Nickel plating Anodize for AL |
Thickness can be 1.2mm or 1.5mm.
Custom marking Custom machining Custom design Recessed Barcode pad |
Addr: Building 3, sensing equipment Industrial Park, 503 Nanhu Avenue, Wuxi.
Tel: 0510-82391968
Fax: 0510-85037168
E-mail: James.Wu@jpmechanics.com














